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MICROWAVE OFFICE®
Overview
Microwave Office RF/microwave design software is the industry's fastest growing microwave design platform. Microwave Office has revolutionized the communications design world by providing users with a superior choice. Built on the unique AWR high-frequency design environment platform with its unique unified data model™, Microwave Office offers unparalleled intuitiveness, powerful and innovative technologies, and unprecedented openness and interoperability, enabling integration with best-in-class tools for each part of the design process.
Microwave Office design suite encompasses all the tools essential for high-frequency IC, PCB and module design, including:
- Linear circuit simulators
- Non-linear circuit simulators
- Electromagnetic (EM) analysis tools
- Integrated schematic and layout
- Statistical design capabilities
- Parametric cell libraries with built-in design-rule check (DRC).
To learn more about Microwave Office software as a MMIC, Module or Signal Integrity design platform, read on:
- Microwave Office for MMIC Design
- Microwave Office for Module Design
- Microwave Office for Signal Integrity Design
- Microwave Office for RF PCB Design
Microwave Office 2010
Read more about Microwave Office 2010 on our campaign page >>
View related Microwave Office videos on AWR.TV:
- Overview of Microwave Office 2010
- Microwave Office 2010 - Constant Output Power Feature
-
Connectivity Checker in Microwave Office 2010
- iFilter Distributed Synthesis
- AWR Connected for Cadence
- Multi-Rate Harmonic Balance Tutorial
- Constant Output Power Feature
Collateral
White Papers
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ACE White Paper
ACE - Automated Circuit Extraction in the Design Flow -
EXTRACT FLow White Paper
Exactly How EM Should Be Part of a Design Flow -
EXTRACT Flow White Paper (Interactive Flash version with AWR TV videos)
Exactly How EM Should Be Part of a Design Flow -
AWR Nonlinear Modeling
White Paper
AWR's Support of Polyharmonic Distortion and Nonlinear Behavioral Models -
SIP Flow White Paper
Understanding Available Tools For RF System-in-Package and Multi-Chip-Module Design and Optimization