ALLIANCE PARTNERS
Silicon Foundries
The IHP offers access to four 0.25 µm SiGe:C BiCMOS technologies; SG25H1 - A high-performance technology with npn-HBTs up to fT/fmax= 180/220 GHz; SG25H2 - A complementary high-performance technology with npn-HBTs comparable to SG25H1 and additional pnp-HBTs with = 90/125 GHz; SG25H3 - A technology with a set of npn-HBTs, ranging from a higher RF performance (fT/fmax= 110 GHz/190 GHz) to higher breakdown voltages up to 7 V; SGB25VD - A cost-effective technology with a set of npn-HBTs up to a breakdown voltage of 7 V. A distinctive feature of this technology is additional integrated complementary RF LDMOS devices with breakdown voltages up to 26 V.
Jazz Semiconductor is a pure-play semiconductor wafer foundry that serves customers targeting wireless, optical networking, power management, storage, aerospace/defense and other high-performance applications. Jazz's rich heritage in mixed-signal/RF processes and circuit design platforms has provided the foundation for its strong position in silicon germanium (SiGe), as well as RF CMOS and bipolar CMOS (BiCMOS) technologies.
Peregrine Semiconductor is a supplier of the industry's most advanced RF and mixed-signal communications ICs which are ideally suited for the wireless infrastructure and mobile wireless; broadband communications; space; defense and avionics markets. Manufactured on the Company’s proprietary UltraCMOS™ technology, the Peregrine product portfolio is poised to meet the demands of a global RF design community – in high-growth applications such as WCDMA and GSM digital cellular, broadband, DTV, DVR, and radiation hard space and defense programs. Peregrine’s products feature monolithic integration and ease-of-development, which are essential to timely and cost-effective application design by our customers.
Taiwan Semiconductor Manufacturing Company Limited
TSMC is a pure-play semiconductor wafer foundry that serves customers targeting wireless, optical networking, power management, storage, aerospace/defense and other high-performance applications. TSMC's rich heritage in mixed-signal/RF processes and circuit design platforms has provided the foundation for its strong position in silicon germanium (SiGe), as well as RF CMOS and bipolar CMOS (BiCMOS) technologies. TSMC's Mixed Signal/RF CMOS processes provide designers with smaller device dimensions, increased performance and lower costs than BiCMOS and gallium arsinide processes. TSMC provides comprehensive design kits for either logic-based or full-featured MS/RF technologies. Plug-in databases and models are ready-to-use, which help significant reductions in design cycle time. These advancements lead to accurate performance prediction and higher levels of integration for TSMC customers. TSMC is the first pure-play foundry to offer silicon germanium (SiGe) BiCMOS technology, which is expected to be in high demand for high performance and low power communications applications. Combining the integration and cost benefits of standard CMOS with the speed of more esoteric and expensive technologies, such as Gallium Arsenide (GaAs), Silicon Germanium is ideally suited for communications and wireless/optical networking designs. TSMC has also collaborated with several EDA providers including AWR to create complete design kits including technology files and Process Design Kits (PDK). The PDK includes schematic symbols, simulation models, a layout generator, and tech files. With the PDK, designers can efficiently reduce their development time of foundation libraries.
